The 5th China Forum of Electronic Plating for Advanced Manufacturing (FEPAM-2026) was held from Aug 21 to 23 in Xiamen, bringing together nearly 500 university and research institute faculty members and students, as well as industry representatives. The forum highlighted advances in AI-driven research on electronic electroplating, including new intelligent research tools for advanced chip packaging.
The forum's organizer, the National Engineering Research Center of Chemicals for Electronic Manufacturing (Reconstruction) (NERC-CEM), unveiled results from its intelligent research platform, including EP-Agent, an intelligent agent for developing electronic electroplating formulations for advanced packaging, jointly developed with the Shanghai Artificial Intelligence Laboratory, and a high-throughput AI agent for developing advanced chip packaging and integration technologies.
Hu Wenping, president of Xiamen University, said at the opening ceremony that electronic electroplating is used throughout chip manufacturing and advanced packaging and directly affects production yields and device stability. He called developing domestic electronic chemicals and electroplating technologies a strategic priority.
The forum featured three sessions and 58 presentations, including seven keynote reports, 37 invited reports and 14 oral presentations. It also included a dedicated session for young scholars and students to showcase their research and exchange ideas.
