The 4th China Forum of Electronic Plating for Advanced Manufacturing is held in Xiamen from June 27 to 29. [Photo/en.xmu.edu.cn]

The 4th China Forum of Electronic Plating for Advanced Manufacturing (FEPAM-2025) was held in Xiamen from June 27 to 29. The forum brought together four members of the Academic Division of the Chinese Academy of Sciences – Liu Sheng, Sun Shigang, Xie Suyuan, and Zheng Nanfeng – along with nearly 400 representatives from universities, research institutions, and enterprises. Participants engaged in discussions on technological breakthroughs and industrial upgrading in the field of electronic plating.

The forum featured three parallel sessions: "fundamentals, process technologies and equipment for high-end manufacturing electronic plating", "electronic plating for chip manufacturing and packaging integration", and "high-end electronic chemicals and next-generation semiconductor and electronic materials". The event comprised five plenary lectures, 39 invited presentations, 14 oral reports, and a specialized workshop on advanced interconnected technologies for integrated circuits.

At the closing ceremony, Sun Shigang, initiator of the forum and chairman of the organizing committee, put forward three key proposals: strengthening fundamental research, deepening industry-academia-research collaboration, and accelerating the interdisciplinary talent cultivation to address international challenges.

The FEPAM is China's first national-level platform bridging fundamental research and industrial applications in this field. It aims to address national strategic needs and drive technological breakthroughs in industry.